NSHC392J50TRB1F Datasheet | NIC

Features - STACKED METALLIZED POLYPHENYLENE SULFIDE (PPS) FILM - STANDARD EIA 0603, 0805, 1206, 1210, 1913 AND 2416 SIZES - WIDE TEMPERATURE RANGE UP TO +125OC (100p F ~ 0.1μF) - HIGH HEAT AND MOISTURE RESISTANT - VERY STABLE TEMPERATURE, FREQUENCY AND VOLTAGE BIAS CHARACTERISTICS - SUITABLE FOR REFLOW SOLDERING - TAPE AND REEL PACKAGING NSHC IS REMENDED FOR NEW DESIGNS NSHC Series includes all homogeneous materials Ro HS pliant - See Part Number System for Details SPECIFICATIONS Capacitance Range Voltage Ratings Capacitance Tolerance Temperature Range Dissipation Factor (20°C) Insulation Resistance (20°C) Dielectric Withstanding Voltage Temperature Characteristic Case Sizes 0603 0805 1206 1210 1913 2416 100p F ~ 0.0027μF 100p F ~ .01μF 3300p F ~ .047μF .012μF ~ .1μF .047μF ~ .1μF .12μF ~ .22μF 16Vdc (12Vrms), 50Vdc (40Vrms) ±5% Std, ±2% Opt. -55°C ~ +125°C (0.12μF ~ 0.22μF voltage derated above +105°C) 0.6% max. @ 1KHz 3 Gigohms Minimum 150% of Rated Voltage 60 Seconds or 175% of Rated Voltage for 5 Seconds (except 1913 and 2416 case sizes) ±3% ΔC Maximum Over Temperature Range ENVIRONMENTAL CHARACTERISTICS Life Test At +125°C 1,000 Hours at 125% of Rated Voltage Resistance to Soldering Heat +260°C Peak Humidity Load Life: (1) 1000 Hours, +40°C (2) 500 Hours, +60°C (3) 500 Hours +85°C/85% RH Solderability with 25% Wt Rosin-Methanol Flux Capacitance Change Dissipation Factor Insulation Resistance Capacitance Change Dissipation Factor Insulation Resistance Capacitance Change Dissipation Factor Insulation Resistance Within ±2% of Initial Value 0.68% Maximum 1 Gigohm Minimum Within ±3% of Initial Value 0.66% Maximum 1 Gigohm Minimum (1) & (2) Within ±2% of Initial value (3) Within ±10% of initial value (1) & (2) 0.90% Maximum (3) 1.2% maximum (1) 1 Gigohm Minimum (2) 0.5 Gigohm Minimum (3) 0.01 Gigohm min. 90% Minimum Coverage After 2.5 Second Dip into 255°C Solder Pot REMENDED REFLOW PROFILE (maximum 2 times) 300 Peak Temperature 260°C Temperature - Deg....