Ceramics / Hard Glass/Kovar
Au-plated
Au-plated
0.29g(TYP)
K
A
Die Heat Sink
Protection Device
3
SOLDERING
Recommended Reflow Soldering Condition(Lead-free Solder)
1 to 5°C per sec
Pre-heat 180 to 200°C
60sec Max Above 220°C
120sec Max
260°CMax 10sec Max
Recommended Sol
Full PDF Text Transcription for NCSU334B (Reference)
Note: Below is a high-fidelity text extraction (approx. 800 characters) for
NCSU334B. For precise diagrams, and layout, please refer to the original PDF.
NICHIA STS-DA1-6154C <Cat.No.220825> NICHIA CORPORATION SPECIFICATIONS FOR UV LED PART NO. NCSU334B(T) ● Pb-free Reflow Soldering Application ● Built-in ESD Protection De...
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T) ● Pb-free Reflow Soldering Application ● Built-in ESD Protection Device ● RoHS Compliant SPECIFICATIONS NICHIA STS-DA1-6154C <Cat.No.220825> (1) Absolute Maximum Ratings Item Symbol Absolute Maximum Rating Forward Current IF 500 Pulse Forward Current IFP 600 Allowable Reverse Current IR 85 Power Dissipation PD Operating Temperature Topr 3.49 -10~85 Storage Temperature Tstg -40~100 Junction Temperature TJ 110 * Absolute Maximum Ratings at TS=25°C. * IFP conditions with pulse width ≤10ms and duty cycle ≤10%.