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NESB064AT-NA - LED

General Description

Package Materials Encapsulating Resin Materials Electrodes Materials Weight Heat-Resistant Polymer (） Silicone Resin(with phosphor) + Ag-plated Copper Alloy 0.036g(TYP) A Protection Device 4 SOLDERING NICHIA STS-DA1-2142B Recommended Reflow Soldering Condition(

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Other Datasheets by Nichia Corporation

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NICHIA STS-DA1-2142B NICHIA CORPORATION SPECIFICATIONS FOR LED NESB064AT-NA ● Pb-free Reflow Soldering Application ● Built-in ESD Protection Device ● RoHS Compliant ● ISO/TS16949 Compliant SPECIFICATIONS NICHIA STS-DA1-2142B (1) Absolute Maximum Ratings Item Symbol Absolute Maximum Rating Forward Current IF 30 Pulse Forward Current IFP 100 Allowable Reverse Current IR 85 Power Dissipation PD 105 Operating Temperature Topr -40~110 Storage Temperature Tstg -40~110 Junction Temperature TJ 125 * Absolute Maximum Ratings at TA=25°C. * IFP conditions with pulse width ≤10ms and duty cycle ≤10%.