NFSW172T Overview
パッケージ材質 Package Materials セラミックス Ceramics 封止樹脂材質 Encapsulating Resin Materials シリコーン樹脂 (拡散剤+蛍光体入り) Silicone Resin (with diffuser and phosphor) 電極材質 金メッキ 0.5 Anode Electrodes Materials Au-plated 2.7 質量 Weight 0.024g (TYP) A 保護素子 Protection Device 3 SOLDERING Remended Reflow Soldering Condition 1 to 5°C per sec. Pre-heat 180 to 200°C 60 sec. Remended Soldering Pad Pattern 3.6 0.5 NICHIA STS-DA1-1259A <Cat.No.101130>.