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NSSB064AT-N2 - LED

General Description

Heat-Resistant Polymer (） Silicone Resin(with phosphor) + Ag-plated Copper Alloy 0.037g(TYP) K A Protection Device 4 SOLDERING NICHIA STS-DA1-1789B Recommended Reflow Soldering Condition(Lead-free Solder) 1 to 5°C per sec Pre-heat 180 to 200°C 60sec Max Above 220°C

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NICHIA STS-DA1-1789B NICHIA CORPORATION SPECIFICATIONS FOR LED NSSB064AT-N2 ● Pb-free Reflow Soldering Application ● Built-in ESD Protection Device ● RoHS Compliant ● IATF 16949 Compliant SPECIFICATIONS (1) Absolute Maximum Ratings Item Symbol Absolute Maximum Rating Forward Current IF 50 Pulse Forward Current IFP 200 Allowable Reverse Current IR 85 Power Dissipation PD 165 Operating Temperature Topr -40~110 Storage Temperature Tstg -40~110 Junction Temperature TJ 125 * Absolute Maximum Ratings at TA=25°C. * IFP conditions with pulse width ≤10ms and duty cycle ≤10%.