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NVSA219BT - LED

General Description

Package Materials Encapsulating Resin Materials Electrodes Materials Lens Materials Die Heat Sink Materials Weight Ceramics （） Silicone Resin (with phosphor) Au-plated Silicone Resin Au-plated 0.032g (TYP) KA Die Heat Sink Protection Device 4 0.4 1.2 1.9 3.3 0.5 SOLDERING

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Full PDF Text Transcription for NVSA219BT (Reference)

Note: Below is a high-fidelity text extraction (approx. 800 characters) for NVSA219BT. For precise diagrams, and layout, please refer to the original PDF.

NICHIA STS-DA1-2797A <Cat.No.130617> NICHIA CORPORATION SPECIFICATIONS FOR AMBER LED NVSA219BT ● Pb-free Reflow Soldering Application ● Built-in ESD Protection Device ● R...

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free Reflow Soldering Application ● Built-in ESD Protection Device ● RoHS Compliant SPECIFICATIONS (1) Absolute Maximum Ratings Item Symbol Absolute Maximum Rating Forward Current IF 1500 Pulse Forward Current IFP 2000 Allowable Reverse Current IR 85 Power Dissipation PD 5.1 Operating Temperature Topr -40~100 Storage Temperature Tstg -40~100 Junction Temperature TJ 150 * Absolute Maximum Ratings at TS=25°C. * IFP conditions with pulse width ≤10ms and duty cycle ≤10%.

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