FEATURES
For surface mounted applications in order to optimize board space Low profile package Built-in strain relief Glass passivated junction Low inductance Typical IR less than 5.0uA above 11V High temperature soldering guaranteed: 260°C / 10 seconds at terminals Plastic package has Underwriters Laboratory Flammability Classification 94V-0 SMA/DO-214AC MECANICAL DATA Case: Molded plastic over passivated junction Terminals: Pure tin plated lead free, solderable per MIL-STD-750, Method 2025 Polarity:Color Band denotes positive end (cathode) Standard packaging: 12mm tape (EIA-481) Weight: 0.002 ounces, 0.064 gram Dimensions in inches and (millimeters) Pb-free; RoHS-compliant MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
o (Ratings at 25 C ambient temperature unless otherwise specified.) Type Number Peak Power Dissipation at TA=50 C, Derate above o 50 C ( Note 1 ) Peak Forward Surge Current, 8.3 ms Single Half Sine-wave Superimposed on Rated Load (JEDEC method) ( Note 2 ) o Symbol PD IFSM Value 1.0 6.67 10.0 Units Watts mW/ oC Amps o Operating and Storage Temperature Range TJ, TSTG -55 to + 150 C 2 1.
