• Part: WF5075xx-4
  • Description: VCXO
  • Manufacturer: NPC
  • Size: 328.17 KB
WF5075xx-4 Datasheet (PDF) Download
NPC
WF5075xx-4

Key Features

  • A× version: for Flip Chip Bonding
  • B× version: for Wire Bonding Package: Wafer form (WF5075××) Chip form (CF5075××)
WF5075xx-4 datasheet preview