IP4385CX4
Description
IP4085CX4/LF/P WLCSP4 wafer level chip-size package: 4 bumps (2 2)[1] IP4385CX4/LF wafer level chip-size package: 4 bumps (2 2)[2] IP4386CX4/P IP4387CX4/P [1] Size: 0.91 0.91 0.65 mm [2] Size: 0.76 0.76 0.61 mm Version IP4085CX4/LF/P IP4385CX4/LF IP4386CX4/P IP4387CX4/P IP4085_4385_4386_4387_CX4 Product data sheet All information provided in this document is subject to legal disclaimers. 2 - 14 December 2012 © NXP B.V.
Key Features
- Single integrated high-performance ESD protection diode
- ESD protection of >30 kV contact discharge, far exceeding IEC 61000-4-2, level 4
- Mobile handsets
- Portable devices
- Wireless data systems NXP Semiconductors IP4085/4385/4386/4387/CX4 Integrated high-performance ESD protection diodes
