NXP Semiconductors BAT74V
The only recommended soldering method is reflow soldering.FEATURES
● Low forward voltage● Low capacitance
● Ultra small SMD plastic package
● Flat leads: excellent coplanarity and improved thermal behaviour.
APPLICATIONS
● Ultra high-speed switching● Voltage clamping
● Line termination
● Inverse polarity protection.
DESCRIPTION
Planar Schottky barrier double diode with an integrated guard ring for stress protection. Two separate dies encapsulated in a SOT666 ultra small SMD plastic package. 1 1 Top view Marking code: 74. 2 3 MAM461 BAT74V PINNING PIN 1 2 3 4 5 6 anode 1 not connected cathode 2 anode 2 not connected cathode 1DESCRIPTION
handbook, halfpage 6 5 4 6 4 3 Fig.1 Simplified outline (SOT666) and symbol. LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 60134). SYMBOL VR IF IFRM IFSM Ptot Tstg Tj Tamb PARAMETER continuous reverse voltage continuous forward current repetitive peak forward current non-repetitive peak forward current total power dissipation storage temperature junction temperature operating ambient temperature tp ≤ 1 s; δ ≤ 0.5 tp < 10 ms Tamb ≤ 25 °C − −65 − −65 CONDITIONS − − − MIN.