NXP Semiconductors BAT960
The only recommended soldering method is reflow soldering.| Part No. | BAT960 |
|---|---|
| Datasheet | BAT960 Download |
| Manufacturer |  NXP Semiconductors |
| Description | Schottky barrier diode |
| Buy | Stock & Price |
FEATURES
● High current capability● Very low forward voltage
● Ultra small plastic SMD package
● Flat leads: excellent coplanarity and improved thermal behaviour.
APPLICATIONS
● Ultra high-speed switching● rectification
● DC/DC conversion
● Switch mode power supply
● Inverse polarity protection. PINNING PIN 1 cathode 2 cathode 3 anode 4 anode 5 cathode 6 cathode
DESCRIPTION
handbook, halfpag6e 5 4GENERAL DESCRIPTION
Planar Schottky barrier diode with an integrated guard ring for stress protection in a SOT666 ultra small SMD plastic package. 123 1, 2 5, 6 3, 4 MHC310 Marking code: B9. Fig.1 Simplified outline (SOT666) and symbol. LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 60134). SYMBOL PARAMETER VR continuous reverse voltage IF continuous forward current IFSM non-repetitive peak forward current Tstg Tj Tamb storage temperature junction temperature operating ambient temperature CONDITIONS t = 8.3 ms half sinewave; JEDEC method; note 1 Note 1. Only valid, if pins 3 and 4 are connected in parallel.
