BC52PAS
Overview
PNP medium power transistor series encapsulated in an ultra thin DFN2020D-3 (SOT1061D) leadless small Surface-Mounted Device (SMD) plastic package with medium power capability and visible and solderable side pads.
- High collector current capability
- Three current gain selections IC and ICM
- Reduced Printed-Circuit Board (PCB)
- Leadless very small SMD plastic area requirements package with medium power capability
- Exposed heat sink for excellent thermal
- Suitable for Automatic Optical and electrical conductivity Inspection (AOI) of solder joint
- AEC-Q101 qualified
