NXP Semiconductors BY228
This package is hermetically sealed and fatigue free as coefficients of expansion of all used parts are matched.FEATURES
● Glass passivated● High maximum operating temperature
● Low leakage current
● Excellent stability
● Available in ammo-pack
● Also available with preformed leads for easy insertion.
APPLICATIONS
● Damper diode in high frequency horizontal deflection circuits up to 16 kHz.DESCRIPTION
Rugged glass package, using a high temperature alloyed construction. BY228 2/3 page k (Datasheet) Fig.1 Simplified outline (SOD64) and symbol. , a MAM104 LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL VRSM VRRM VR IFWM IFRM IFSM PARAMETER non-repetitive peak reverse voltage repetitive peak reverse voltage continuous reverse voltage working peak forward current repetitive peak forward current non-repetitive peak forward current t = 10 ms half sinewave; Tj = Tj max prior to surge; VR = VRRMmax Tamb = 75 °C; PCB mounting (see Fig.4); see Fig.2 CONDITIONS MIN. − − − − − − MAX. 1650 1650 1500 5 10 50 V V V A A A UNIT Tstg Tj storage temperature junction temperature −65 −65 +175 +150 °C °CELECTRICAL CHARACTERISTICS
Tj = 25 °C; unless otherwise specified.