BY228 Datasheet (PDF) Download
NXP Semiconductors
BY228

Overview

  • Glass passivated
  • High maximum operating temperature
  • Low leakage current
  • Excellent stability
  • Available in ammo-pack
  • Also available with preformed leads for easy insertion. APPLICATIONS
  • Damper diode in high frequency horizontal deflection circuits up to 16 kHz. DESCRIPTION Rugged glass package, using a high temperature alloyed construction. BY228 This package is hermetically sealed and fatigue free as coefficients of expansion of all used parts are matched. 2/3 page k (Datasheet) Fig.1 Simplified outline (SOD64) and symbol.  , a MAM104