NXP Semiconductors BY448
This package is hermetically sealed and fatigue free as coefficients of expansion of all used parts are matched.FEATURES
● Glass passivated● High maximum operating temperature
● Low leakage current
● Excellent stability
● Available in ammo-pack.
APPLICATIONS
● Damper diode in high frequency horizontal deflection circuits up to 16 kHz.DESCRIPTION
Rugged glass package, using a high temperature alloyed construction. BY448 2/3 page k (Datasheet) LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL VRSM VRRM VR IFWM IFRM IFSM PARAMETER non-repetitive peak reverse voltage repetitive peak reverse voltage continuous reverse voltage working peak forward current repetitive peak forward current non-repetitive peak forward current a MAM047 Fig.1 Simplified outline (SOD57) and symbol. CONDITIONS MIN. − − − MAX. 1650 1650 1500 4 8 30 V V V A A A UNIT Tamb = 50 °C; PCB mounting (see Fig 4); see Fig.2 t = 10 ms half sinewave; Tj = Tj max prior to surge; VR = VRRMmax − − − Tstg Tj storage temperature junction temperature −65 −65 +175 +150 °C °CELECTRICAL CHARACTERISTICS
Tj = 25 °C; unless otherwise specified.