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BY448

Manufacturer: NXP Semiconductors

BY448 datasheet by NXP Semiconductors.

BY448 datasheet preview

BY448 Datasheet Details

Part number BY448
Datasheet BY448_PhilipsSemiconductors.pdf
File Size 52.00 KB
Manufacturer NXP Semiconductors
Description Damper diode
BY448 page 2 BY448 page 3

BY448 Overview

Rugged glass package, using a high temperature alloyed construction. BY448 This package is hermetically sealed and fatigue free as coefficients of expansion of all used parts are matched. 2/3 page k (Datasheet) LIMITING VALUES In accordance with the Rating System (IEC 134).

BY448 Key Features

  • Glass passivated
  • High maximum operating temperature
  • Low leakage current
  • Excellent stability
  • Available in ammo-pack

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