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BY448 - Damper diode

General Description

Rugged glass package, using a high temperature alloyed construction.

This package is hermetically sealed and fatigue free as coefficients of expansion of all used parts are matched.

LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134).

Key Features

  • Glass passivated.
  • High maximum operating temperature.
  • Low leakage current.
  • Excellent stability.
  • Available in ammo-pack.

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Full PDF Text Transcription for BY448 (Reference)

Note: Below is a high-fidelity text extraction (approx. 800 characters) for BY448. For precise diagrams, and layout, please refer to the original PDF.

DISCRETE SEMICONDUCTORS DATA SHEET handbook, 2 columns M3D116 BY448 Damper diode Product specification Supersedes data of May 1996 1996 Sep 26 Philips Semiconductors Produ...

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n Supersedes data of May 1996 1996 Sep 26 Philips Semiconductors Product specification Damper diode FEATURES • Glass passivated • High maximum operating temperature • Low leakage current • Excellent stability • Available in ammo-pack. APPLICATIONS • Damper diode in high frequency horizontal deflection circuits up to 16 kHz. DESCRIPTION Rugged glass package, using a high temperature alloyed construction. BY448 This package is hermetically sealed and fatigue free as coefficients of expansion of all used parts are matched. 2/3 page k (Datasheet) LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134).