NXP Semiconductors BY527
This package is hermetically sealed and fatigue free as coefficients of expansion of all used parts are matched.FEATURES
● Glass passivated● High maximum operating temperature
● Low leakage current
● Excellent stability
● Guaranteed avalanche energy absorption capability
● Available in ammo-pack.
DESCRIPTION
BY527 Rugged glass package, using a high temperature alloyed construction. 2/3 page k (Datasheet) LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL VRRM VRWM VR IF(AV) PARAMETER repetitive peak reverse voltage crest working reverse voltage continuous reverse voltage average forward current a MAM047 Fig.1 Simplified outline (SOD57) and symbol. CONDITIONS MIN. − − − MAX. 1250 800 800 2.0 V V V A UNIT Ttp = 45 °C; lead length = 10 mm; averaged over any 20 ms period; see Figs 2 and 4 Tamb = 80 °C; PCB mounting (see Fig.9); averaged over any 20 ms period; see Figs 3 and 4 − − 0.8 A IFSM ERSM Tstg Tj non-repetitive peak forward current non-repetitive peak reverse avalanche energy storage temperature junction temperature t = 10 ms half sinewave L = 120 mH; Tj...