BYD1100 - Hyper fast soft-recovery rectifier

NXP Semiconductors

General Description

Cavity free cylindrical glass package through Implotec™(1) technology.

and fatigue free as coefficients of expansion of all used parts are matched.

(1) Implotec is a trademark of Philips.

Key Features

Glass passivated.
High maximum operating temperature.
Low leakage current.
Excellent stability.
Smallest surface mount rectifier outline.
Shipped in 8 mm embossed tape.

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BYD1100 hyper fast soft-recovery rectifier by NXP Semiconductors - Datasheet Preview

Datasheet Details

Part number	BYD1100
Manufacturer	NXP Semiconductors
File Size	63.89 KB
Description	Hyper fast soft-recovery rectifier
Datasheet	BYD1100 Datasheet

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DISCRETE SEMICONDUCTORS DATA SHEET k, halfpage M3D121 BYD1100 Hyper fast soft-recovery rectifier Product speciﬁcation Supersedes data of 1998 Dec 03 1999 Nov 16 Philips Semiconductors Hyper fast soft-recovery rectiﬁer Product speciﬁcation BYD1100 FEATURES • Glass passivated • High maximum operating temperature • Low leakage current • Excellent stability • Smallest surface mount rectifier outline • Shipped in 8 mm embossed tape. DESCRIPTION Cavity free cylindrical glass package through Implotec™(1) technology. This package is hermetically sealed and fatigue free as coefficients of expansion of all used parts are matched. (1) Implotec is a trademark of Philips. handbook, 4 columns ka MAM061 Fig.1 Simplified outline (SOD87) and symbol.