Datasheet4U Logo Datasheet4U.com
NXP Semiconductors logo

BYD13G

Manufacturer: NXP Semiconductors

BYD13G datasheet by NXP Semiconductors.

BYD13G datasheet preview

BYD13G Datasheet Details

Part number BYD13G
Datasheet BYD13G_PhilipsSemiconductors.pdf
File Size 39.22 KB
Manufacturer NXP Semiconductors
Description Controlled avalanche rectifiers
BYD13G page 2 BYD13G page 3

BYD13G Overview

MARKING Cavity free cylindrical glass package through Implotec™(1) technology. This package is hermetically sealed and fatigue free as coefficients of expansion of all used parts are matched. (1) Implotec is a trademark of Philips.

BYD13G Key Features

  • Glass passivated
  • High maximum operating temperature
  • Low leakage current
  • Excellent stability
  • Guaranteed avalanche energy absorption capability
  • Available in ammo-pack. DESCRIPTION MARKING Cavity free cylindrical glass package through Implotec™(1) technology. This
NXP Semiconductors logo - Manufacturer

More Datasheets from NXP Semiconductors

View all NXP Semiconductors datasheets

Part Number Description
BYD13 Controlled avalanche rectifiers
BYD13D Controlled avalanche rectifiers
BYD13J Controlled avalanche rectifiers
BYD13K Controlled avalanche rectifiers
BYD13M Controlled avalanche rectifiers
BYD11 Controlled avalanche rectifiers
BYD1100 Hyper fast soft-recovery rectifier
BYD11D Controlled avalanche rectifiers
BYD11G Controlled avalanche rectifiers
BYD11J Controlled avalanche rectifiers

BYD13G Distributor

Datasheet4U Logo
Since 2006. D4U Semicon. About Datasheet4U Contact Us Privacy Policy Purchase of parts