NXP Semiconductors BYD17M
This package is hermetically sealed and fatigue free as coefficients of expansion of all used parts are matched.FEATURES
● Glass passivated● High maximum operating temperature
● Low leakage current
● Excellent stability
● Guaranteed avalanche energy absorption capability
● Shipped in 8 mm embossed tape
● Smallest surface mount rectifier outline.
DESCRIPTION
Cavity free cylindrical glass package through Implotec™(1) technology. (1) Implotec is a trademark of Philips. MAM061 BYD17 series handbook, 4 columns k a Fig.1 Simplified outline (SOD87) and symbol. MARKING TYPE NUMBER BYD17D BYD17G BYD17J BYD17K BYD17M 17D PH 17G PH 17J PH 17K PH 17M PH MARKING CODE LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL VRRM BYD17D BYD17G BYD17J BYD17K BYD17M VRWM crest working reverse voltage BYD17D BYD17G BYD17J BYD17K BYD17M VR continuous reverse voltage BYD17D BYD17G BYD17J BYD17K BYD17M − − − − − 200 400 600 800 1000 V V V V V − − − − − 200 400 600 800 1000 V V V V V PARAMETER repetitive peak reverse voltage − − − − − 200 400 600 800 1000 V V V V V CONDITIONS MIN. MAX.