NXP Semiconductors BYD33G
This package is hermetically sealed k a MAM123 Fig.1 Simplified outline (SOD81) and symbol.| Part No. | BYD33G |
|---|---|
| Datasheet | BYD33G Download |
| Manufacturer |  NXP Semiconductors |
| Description | Fast soft-recovery controlled avalanche rectifiers |
| Buy | Stock & Price |
FEATURES
● Glass passivated● High maximum operating temperature
● Low leakage current
● Excellent stability
● Guaranteed avalanche energy absorption capability
● Available in ammo-pack. handbook, 4 columns BYD33 series and fatigue free as coefficients of expansion of all used parts are matched. (1) Implotec is a trademark of Philips.
DESCRIPTION
Cavity free cylindrical glass package through Implotec™(1) technology. LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL VRRM BYD33D BYD33G BYD33J BYD33K BYD33M BYD33U BYD33V VR continuous reverse voltage BYD33D BYD33G BYD33J BYD33K BYD33M BYD33U BYD33V IF(AV) average forward current BYD33D to M BYD33U and V IF(AV) average forward current BYD33D to M BYD33U and V IFRM repetitive peak forward current BYD33D to M BYD33U and V Ttp = 55 °C; lead length = 10 mm; see Figs 2 and 3; averaged over any 20 ms period; see also Figs 10 and 11 Tamb = 65 °C; PCB mounting (see Fig.19); see Figs 4 and 5; averaged over any...
