BYD33V - Fast soft-recovery controlled avalanche rectifiers
NXP Semiconductors
General Description
Cavity free cylindrical glass package through Implotec™(1) technology.
Fig.1 Simplified outline (SOD81) and symbol.
LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134).
Key Features
Glass passivated.
High maximum operating temperature.
Low leakage current.
Excellent stability.
Guaranteed avalanche energy absorption capability.
Available in ammo-pack. handbook, 4 columns
BYD33 series
and fatigue free as coefficients of expansion of all used parts are matched. (1) Implotec is a trademark of Philips.
Full PDF Text Transcription for BYD33V (Reference)
Note: Below is a high-fidelity text extraction (approx. 800 characters) for
BYD33V. For precise diagrams, and layout, please refer to the original PDF.
DISCRETE SEMICONDUCTORS DATA SHEET k, halfpage M3D119 BYD33 series Fast soft-recovery controlled avalanche rectifiers Product specification Supersedes data of 1996 Jun 05 ...
View more extracted text
lanche rectifiers Product specification Supersedes data of 1996 Jun 05 1996 Sep 18 Philips Semiconductors Product specification Fast soft-recovery controlled avalanche rectifiers FEATURES • Glass passivated • High maximum operating temperature • Low leakage current • Excellent stability • Guaranteed avalanche energy absorption capability • Available in ammo-pack. handbook, 4 columns BYD33 series and fatigue free as coefficients of expansion of all used parts are matched. (1) Implotec is a trademark of Philips. DESCRIPTION Cavity free cylindrical glass package through Implotec™(1) technology. This package is hermetically seale
BYD33V Datasheet
