BYD37K Datasheet | NXP Semiconductors

FEATURES - Glass passivated - High maximum operating temperature - Low leakage current - Excellent stability - Guaranteed avalanche energy absorption capability - Smallest surface mount rectifier outline - Shipped in 8 mm embossed tape. handbook, 4 columns BYD37 series and fatigue free as coefficients of expansion of all used parts are matched. (1) Implotec is a trademark of Philips. DESCRIPTION Cavity free cylindrical glass package through Implotec™(1) technology. This package is hermetically sealed k a MAM061 Fig.1 Simplified outline (SOD87) and symbol. LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL VRRM BYD37D BYD37G BYD37J BYD37K BYD37M VR continuous reverse voltage BYD37D BYD37G BYD37J BYD37K BYD37M IF(AV) average forward current Ttp = 105 °C; see Fig.2; averaged over any 20 ms period; see also Fig.6 Tamb = 60 °C; PCB mounting (see Fig.11); see Fig.3; averaged over any 20 ms period; see also Fig.6 Ttp = 105 °C; see Fig.4 Tamb = 60 °C; see Fig.5 IFSM non-repetitive peak forward current t = 10 ms half sine wave; Tj = Tj max prior to surge; VR = VRRMmax - - - - - - 200 400 600 800 1000 1.5 V V V V V A PARAMETER repetitive peak reverse voltage - - - - - 200 400 600 800 1000 V V V V V CONDITIONS MIN. MAX. UNIT IF(AV) average forward current - 0.6 IFRM repetitive peak forward current - - - 13 5.5 20 1999 Nov 16 Philips Semiconductors Product specification Fast soft-recovery controlled avalanche rectifiers SYMBOL ERSM PARAMETER non-repetitive peak reverse avalanche energy BYD37D to J BYD37K and M Tstg Tj storage temperature junction temperature see Fig.7 CONDITIONS L = 120 m H; Tj = Tj max prior to surge; inductive load switched off - - - 65 - 65 BYD37 series MIN. MAX....