Datasheet4U Logo Datasheet4U.com
NXP Semiconductors logo

BYD57 Datasheet

Manufacturer: NXP Semiconductors
BYD57 datasheet preview

Datasheet Details

Part number BYD57
Datasheet BYD57_PhilipsSemiconductors.pdf
File Size 77.80 KB
Manufacturer NXP Semiconductors
Description Ultra-fast soft-recovery controlled avalanche rectifiers
BYD57 page 2 BYD57 page 3

BYD57 Overview

Cavity free cylindrical glass SOD87 package through Implotecâ„¢(1) technology. The SOD87 is handbook, 4 columns k a Fig.1 Simplified outline (SOD87) and symbol. LIMITING VALUES In accordance with the Rating System (IEC 134).

BYD57 Key Features

  • Glass passivated
  • High maximum operating temperature
  • Low leakage current
  • Excellent stability
  • Guaranteed avalanche energy absorption capability
  • Shipped in 8 mm embossed tape
  • Smallest surface mount rectifier outline

BYD57ZH from other manufacturers

See all manufacturers

Brand Logo Part Number Description Other Manufacturers
Zowie Logo BYD57ZH High Efficient Rectifier Zowie
NXP Semiconductors logo - Manufacturer

More Datasheets from NXP Semiconductors

See all NXP Semiconductors datasheets

Part Number Description
BYD57D Ultra-fast soft-recovery controlled avalanche rectifiers
BYD57G Ultra-fast soft-recovery controlled avalanche rectifiers
BYD57J Ultra-fast soft-recovery controlled avalanche rectifiers
BYD57K Ultra-fast soft-recovery controlled avalanche rectifiers
BYD57M Ultra-fast soft-recovery controlled avalanche rectifiers
BYD57U Ultra-fast soft-recovery controlled avalanche rectifiers
BYD57V Ultra-fast soft-recovery controlled avalanche rectifiers
BYD52 Fast soft-recovery controlled avalanche rectifiers
BYD52D Fast soft-recovery controlled avalanche rectifiers
BYD52G Fast soft-recovery controlled avalanche rectifiers

BYD57 Distributor

Datasheet4U Logo
Since 2006. D4U Semicon. About Datasheet4U Contact Us Privacy Policy Purchase of parts