NXP Semiconductors BYV26C
This package is hermetically sealed and fatigue free as coefficients of expansion of all used parts are matched.FEATURES
● Glass passivated● High maximum operating temperature
● Low leakage current
● Excellent stability
● Guaranteed avalanche energy absorption capability
● Available in ammo-pack.
DESCRIPTION
Rugged glass SOD57 package, using a high temperature alloyed construction. BYV26 series 2/3 page k (Datasheet) LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL VRRM PARAMETER repetitive peak reverse voltage BYV26A BYV26B BYV26C BYV26D BYV26E BYV26F BYV26G VR continuous reverse voltage BYV26A BYV26B BYV26C BYV26D BYV26E BYV26F BYV26G IF(AV) average forward current BYV26A to E BYV26F and G IF(AV) average forward current BYV26A to E BYV26F and G IFRM repetitive peak forward current BYV26A to E BYV26F and G a MAM047 Fig.1 Simplified outline (SOD57) and symbol. CONDITIONS MIN. − − − − − − − − − − − − − − MAX. 200 400 600 800 1000 1200 1400 200 400 600 800 1000 1200 1400 1.00 1.05 V V V V V V V V V V V V V V A A UNIT Ttp = 85 °C; lead length = 10 mm; see Fig...