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BYV26D - Fast soft-recovery controlled avalanche rectifiers

General Description

Rugged glass SOD57 package, using a high temperature alloyed construction.

This package is hermetically sealed and fatigue free as coefficients of expansion of all used parts are matched.

Key Features

  • Glass passivated.
  • High maximum operating temperature.
  • Low leakage current.
  • Excellent stability.
  • Guaranteed avalanche energy absorption capability.
  • Available in ammo-pack.

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Other Datasheets by NXP Semiconductors

Part Number Description
BYV26 Fast soft-recovery controlled avalanche rectifiers
BYV26A Fast soft-recovery controlled avalanche rectifiers
BYV26B Fast soft-recovery controlled avalanche rectifiers
BYV26C Fast soft-recovery controlled avalanche rectifiers
BYV26E Fast soft-recovery controlled avalanche rectifiers

Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

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DISCRETE SEMICONDUCTORS DATA SHEET handbook, 2 columns M3D116 BYV26 series Fast soft-recovery controlled avalanche rectifiers Product specification Supersedes data of February 1994 1996 May 30 Philips Semiconductors Product specification Fast soft-recovery controlled avalanche rectifiers FEATURES • Glass passivated • High maximum operating temperature • Low leakage current • Excellent stability • Guaranteed avalanche energy absorption capability • Available in ammo-pack. DESCRIPTION Rugged glass SOD57 package, using a high temperature alloyed construction. BYV26 series This package is hermetically sealed and fatigue free as coefficients of expansion of all used parts are matched. 2/3 page k (Datasheet) LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134).