NXP Semiconductors BYV27
This package is hermetically sealed and fatigue free as coefficients of expansion of all used parts are matched.FEATURES
● Glass passivated● High maximum operating temperature
● Low leakage current
● Excellent stability
● Guaranteed avalanche energy absorption capability
● Available in ammo-pack.
DESCRIPTION
Rugged glass SOD57 package, using a high temperature alloyed construction. BYV27 series 2/3 page k (Datasheet) LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL VRRM PARAMETER repetitive peak reverse voltage BYV27-50 BYV27-100 BYV27-150 BYV27-200 BYV27-300 BYV27-400 BYV27-500 BYV27-600 VR continuous reverse voltage BYV27-50 BYV27-100 BYV27-150 BYV27-200 BYV27-300 BYV27-400 BYV27-500 BYV27-600 IF(AV) average forward current BYV27-50 to 200 BYV27-300 and 400 BYV27-500 and 600 IF(AV) average forward current BYV27-50 to 200 BYV27-300 and 400 BYV27-500 and 600 a MAM047 Fig.1 Simplified outline (SOD57) and symbol. CONDITIONS MIN. − − − − − − − − − − − − − − − − MAX. 50 100 150 200 300 400 500 600 50 100 150 200 300 400 500 600 2.0 1.9 1.6 1.30 1.25 1.10 V V V...