BYV36D Datasheet | NXP Semiconductors

- Glass passivated - High maximum operating temperature - Low leakage current - Excellent stability - Guaranteed avalanche energy absorption capability - Available in ammo-pack. DESCRIPTION Rugged glass SOD57 package, using a high temperature alloyed BYV36 series construction. This package is hermetically sealed and fatigue free as coefficients of expansion of all used parts are matched. 2/3 page k (Datasheet) LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL VRRM PARAMETER repetitive peak reverse voltage BYV36A BYV36B BYV36C BYV36D BYV36E BYV36F BYV36G VR continuous reverse voltage BYV36A BYV36B BYV36C BYV36D BYV36E BYV36F BYV36G IF(AV) average forward current BYV36A to C BYV36D and E BYV36F and G IF(AV) average forward current BYV36A to C BYV36D and E BYV36F and G a MAM047 Fig.1 Simplified outline (SOD57) and symbol. CONDITIONS MIN. - - - - - - - - - - - - - - MAX. 200 400 600 800 1000 1200 1400 200 400 600 800 1000 1200 1400 1.6 1.5 1.5 0.87 0.81 0.81 V V V V V V V V V V V V V V A A A A A A UNIT Ttp = 60 °C; lead length = 10 mm; see Figs 2; 3 and 4 averaged over any 20 ms period; see also Figs 14; 15 and 16 Tamb = 60 °C; PCB mounting (see Fig.25); see Figs 5; 6 and 7 averaged over any 20 ms period; see also Figs 14; 15 and 16 - - - - - - 1996 Jul 01 Philips...