NXP Semiconductors BYV96
This package is hermetically sealed and fatigue free as coefficients of expansion of all used parts are matched.FEATURES
● Glass passivated● High maximum operating temperature
● Low leakage current
● Excellent stability
● Guaranteed avalanche energy absorption capability
● Available in ammo-pack.
DESCRIPTION
BYV96 series Rugged glass package, using a high temperature alloyed construction. 2/3 page k (Datasheet) LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL VRRM BYV96D BYV96E VR continuous reverse voltage BYV96D BYV96E IF(AV) average forward current PARAMETER repetitive peak reverse voltage a MAM047 Fig.1 Simplified outline (SOD57) and symbol. CONDITIONS MIN. − − − − MAX. 800 1000 800 1000 1.5 V V V V A UNIT Ttp = 55 °C; lead length = 10 mm see Fig 2; averaged over any 20 ms period; see also Fig 6 Tamb = 55 °C; PCB mounting (see Fig.11); see Fig 3; averaged over any 20 ms period; see also Fig 6 − − 0.8 A IFRM IFSM repetitive peak forward current non-repetitive peak forward current Ttp = 55 °C; see Fig 4 Tamb = 55 °C; see Fig 5 t = 10 ms half sine wave; T...