BYV97 Datasheet | NXP Semiconductors

- Glass passivated - High maximum operating temperature - Low leakage current - Excellent stability - Guaranteed avalanche energy absorption capability - Available in ammo-pack. DESCRIPTION BYV97 series Rugged glass SOD57 package, using a high temperature alloyed construction. This package is hermetically sealed and fatigue free as coefficients of expansion of all used parts are matched. 2/3 page k (Datasheet) LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL VRRM BYV97F BYV97G VR continuous reverse voltage BYV97F BYV97G IF(AV) average forward current PARAMETER repetitive peak reverse voltage a MAM047 Fig.1 Simplified outline (SOD57) and symbol. CONDITIONS MIN. - - - - MAX. 1200 1400 1200 1400 1.6 V V V V A UNIT Ttp = 60 °C; lead length = 10 mm see Fig.2; averaged over any 20 ms period; see also Fig.6 Tamb = 50 °C; PCB mounting (see Fig. 12); see Fig.3; averaged over any 20 ms period; see also Fig.6 Ttp = 65 °C; see Fig.4 Tamb = 65 °C; see Fig.5 t = 10 ms half sine wave; Tj = Tj max prior to surge; VR = VRRMmax L = 120 m H; Tj = Tj max prior to surge; inductive load switched off see Fig.7 - IF(AV) average forward current - 0.9 IFRM IFSM repetitive peak forward current non-repetitive peak forward current - - - 15 8 20 ERSM Tstg Tj non-repetitive peak reverse avalanche energy storage temperature junction temperature - - 65 - 65 10 +175 +175 m J °C...