BYV98 Datasheet | NXP Semiconductors

- Glass passivated - High maximum operating temperature - Low leakage current - Excellent stability - Available in ammo-pack. DESCRIPTION Rugged glass SOD57 package, using a high temperature alloyed BYV98 construction. This package is hermetically sealed and fatigue free as coefficients of expansion of all used parts are matched. 2/3 page k (Datasheet) LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL VRSM VRRM IF(AV) PARAMETER non-repetitive peak reverse voltage repetitive peak reverse voltage average forward current a MAM047 Fig.1 Simplified outline (SOD57) and symbol. CONDITIONS - - Ttp = 55 °C; lead length = 10 mm see Fig. 2; averaged over any 20 ms period; see also Fig. 6 Tamb = 60 °C; PCB mounting (see Fig.11); see Fig. 3; averaged over any 20 ms period; see also Fig. 6 Ttp = 55 °C; see Fig. 4 Tamb = 60 °C; see Fig. 5 t = 10 ms half sine wave; Tj = Tj max prior to surge; VR = VRRMmax see Fig.7 - MIN. MAX. 2100 2000 1.00 V V A UNIT IF(AV) average forward current - 0.43 IFRM IFSM repetitive peak forward current non-repetitive peak forward current - - - 9.0 4.5 15 Tstg Tj storage temperature junction temperature - 65 - 65 +175 +175 °C °C 1996 Jun 07 Philips Semiconductors Product...