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BYX108G Datasheet

Manufacturer: NXP Semiconductors
BYX108G datasheet preview

Datasheet Details

Part number BYX108G
Datasheet BYX108G_PhilipsSemiconductors.pdf
File Size 41.49 KB
Manufacturer NXP Semiconductors
Description High-voltage soft-recovery controlled avalanche rectifiers
BYX108G page 2 BYX108G page 3

BYX108G Overview

Rugged glass package, using a high temperature alloyed construction. This package is hermetically sealed and fatigue free as coefficients of expansion of all used parts are matched. The package is designed to be used in an insulating medium such as resin, oil or SF6 gas.

BYX108G Key Features

  • Glass passivated
  • High maximum operating temperature
  • Low leakage current
  • Excellent stability
  • Guaranteed avalanche energy absorption capability
  • Recovery times ranging from 600 to 50 ns
  • Soft-recovery switching characteristics
  • pact construction
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BYX108G Distributor

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