BYX135G Datasheet | NXP Semiconductors

URES - Glass passivated - High maximum operating temperature - Low leakage current - Excellent stability - Guaranteed avalanche energy absorption capability. APPLICATIONS - Car ignition systems - Automotive applications with extreme temperature requirements. k halfpage handbook, a MBK908 DESCRIPTION Rugged glass package, using a high temperature alloyed construction. The SOD61AD2 is hermetically sealed and fatigue free as coefficients of expansion of all used parts are matched. The package is designed to be used in an insulating medium such as resin, oil or SF6 gas. The BYX135G is marked with a green cathode band on the body. Fig.1 Simplified outline (SOD61AD2) and symbol. LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 60134). SYMBOL VRRM VRWM IF(AV) IRSM Tstg Tj Tj PARAMETER repetitive peak reverse voltage crest working reverse voltage average forward current non-repetitive peak reverse current storage temperature junction temperature junction temperature continuous max. 30 min. t = 100 µs triangular pulse; Tj max prior to surge CONDITIONS - - - - - 65 - - MIN. 5 5 50 50 +200 175 200 MAX. UNIT k V k V m A m A °C °C °C CHARACTERISTICS Tj = 25 °C unless otherwise specified. SYMBOL VF V(BR)R IR PARAMETER forward voltage reverse avalanche breakdown voltage reverse current CONDITIONS IF = 10 m A IR = 100 µA VR = VRWMmax; Tj = 175 °C 7 - MIN. 6.25 MAX. 8.75 9.5 30 V k V µA UNIT THERMAL CHARACTERISTICS SYMBOL Rth j-a PARAMETER thermal resistance from junction to ambient CONDITIONS Tamb = Tleads; lead length = 10 mm VALUE 90 UNIT K/W 2000 Feb 29 Philips Semiconductors Product specification High-voltage car ignition diode GRAPHICAL DATA MGL549 BYX135G handbook, halfpage IF (m A) 0 0 4 8 12 16 VF (V) Dotted line: Tj = 175 °C. Solid line: Tj = 25 °C. 20 Fig.2 Forward current as a function of maximum forward...