BZG03-C150 Overview
DO-214AC surface mountable package with glass passivated chip. BZG03 series The well-defined void-free case is of a transfer-moulded thermo-setting plastic. handbook, 4 columns Fig.1 Simplified outline (DO-214AC;.
BZG03-C150 Key Features
- Glass passivatedb
- High maximum operating temperature
- Low leakage current
- Excellent stability
- UL 94V-O classified plastic package
- Zener working voltage range: 10 to 270 V for 35 types
- Supplied in 12 mm embossed tape. DESCRIPTION DO-214AC surface mountable package with glass passivated chip
