IP3088CX10 Description
The devices are fabricated using monolithic silicon technology and integrate and incorporate up to 16 coils and 24 diodes in a 0.5 mm pitch Wafer-Level Chip-Scale Package (WLCSP).
IP3088CX10 Key Features
- ESD protection to ±30 kV contact discharge, per MIL-STD-883D, Method 3 015
- WLCSP with 0.5 mm pitch