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IP4386CX4 Datasheet PDF

NXP Semiconductors IP4386CX4

The anode and the cathode of ESD protection diode are each connected to two solder balls.
Part No. IP4386CX4
Datasheet IP4386CX4 Download
Manufacturer
NXP Semiconductors
Description Integrated high-performance ESD protection diodes
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IP4386CX4 datasheet page 1 preview

FEATURES AND BENEFITS

● Single integrated high-performance ESD protection diode
● Surge immunity according to IEC 61000-4-5 (8/20 s) up to 60 A (IP4085CX4)
● ESD protection of >30 kV contact discharge, far exceeding IEC 61000-4-2, level 4
● Small 2  2 solder ball WLCSP package with 0.4 mm or 0.5 mm pitch 1.3

APPLICATIONS

General-purpose ESD protection such as for charger interfaces in:
● Mobile handsets
● Portable devices
● Wireless data systems NXP Semiconductors IP4085/4385/4386/4387/CX4 Integrated high-performance ESD protection diodes 2. Pinning information Table 1. Pinning Pin

DESCRIPTION

A1 and A2 cathode B1 and B2 anode Simplified outline bump A1 index area 1 A Graphic symbol A1 A2 2 B1 B2 006aad220 B 008aaa236 transparent top view, solder balls facing down 3. Ordering information Table 2. Ordering information Type number Package Name

DESCRIPTION

IP4085CX4/LF/P WLCSP4 wafer level chip-size package: 4 bumps (2  2)[1] IP4385CX4/LF wafer level chip-size package: 4 bumps (2  2)[...
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