Datasheet Details
| Part number | K40P81M100SF2V2 |
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| Manufacturer | NXP Semiconductors |
| File Size | 1.45 MB |
| Description | MCU |
| Datasheet | K40P81M100SF2V2-NXP.pdf |
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Overview: Freescale Semiconductor, Inc. Data Sheet Document Number: K40P81M100SF2V2 Rev. 4, 09/2017 K40P81M100SF2V2, K40 Sub-Family Data Sheet with Addendum, Supports: MK40DN512VLK10 Revision 4 of the K40 Sub-Family Data Sheet has two parts: • The addendum to Revision 3 of the data sheet, immediately after this cover page. • Revision 3 of the data sheet, after the addendum. The changes described in the addendum have not been implemented in in Revision 3 of the data sheet. 9 Revision history Table 51. Revision History Rev. No. 4 Date 9/2017 Substantial Changes In Thermal specifications / Thermal attributes section, the thermal resistance parameter (junction to case, RJC) is now 9°C/W (it was previously 8°C/W). © 2017 NXP Semiconductors, All rights reserved. Freescale Semiconductor, Inc. Data Sheet Addendum Document Number: K40P81M100SF2V2AD Rev. 0, 09/2017 Addendum to Rev. 3 of the K40P81M100SF2V2, K40 Sub-Family Data Sheet, Supports: MK40DN512VLK10 This addendum identifies changes to Rev. 3 of the K40P81M100SF2V2, K40 Sub-Family Data Sheet. The change described in this addendum has not been implemented in the Rev. 3 data sheet. In the Thermal attributes section, the thermal resistance parameter (junction to case, RJC) is now 9°C/W (it was previously 8°C/W). 5.4.
| Part number | K40P81M100SF2V2 |
|---|---|
| Manufacturer | NXP Semiconductors |
| File Size | 1.45 MB |
| Description | MCU |
| Datasheet | K40P81M100SF2V2-NXP.pdf |
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RJC Thermal resistance, junction to case 80 LQFP 9 Unit C/W Notes 4 © 2017 Freescale Semiconductor, Inc.
All rights reserved.
Freescale Semiconductor Data Sheet: Technical Data Document Number: K40P81M100SF2V2 Rev.
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