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INTEGRATED CIRCUITS
ADDENDUM
Standard Card IC MF1 IC S50 05
Specification “bumped sawn wafer on UV-tape”
Product Specification Revision 3.0 PUBLIC August 2004
Philips Semiconductors
Philips Semiconductors
Product Specification Rev. 3.0 August 2004
Bumped sawn wafer on UV-tape
Standard Card IC MF1 IC S50 05
CONTENTS 1 2 2.1 3 3.1 3.2 3.3 3.4 3.5 4 4.1 5 6 6.1 6.2 7 8 9 SCOPE............................................................................................................................. 3 REFERENCE DOCUMENTS.............................................................................................. 3 Philips Documents.............................................................................................................