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MF1ICS5005 - Standard Card IC

General Description

Initital version.

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Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

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www.DataSheet4U.com INTEGRATED CIRCUITS ADDENDUM Standard Card IC MF1 IC S50 05 Specification “bumped sawn wafer on UV-tape” Product Specification Revision 3.0 PUBLIC August 2004 Philips Semiconductors Philips Semiconductors Product Specification Rev. 3.0 August 2004 Bumped sawn wafer on UV-tape Standard Card IC MF1 IC S50 05 CONTENTS 1 2 2.1 3 3.1 3.2 3.3 3.4 3.5 4 4.1 5 6 6.1 6.2 7 8 9 SCOPE............................................................................................................................. 3 REFERENCE DOCUMENTS.............................................................................................. 3 Philips Documents.............................................................................................................