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MIMX8MD7CVAHZAB - Applications Processors

Download the MIMX8MD7CVAHZAB datasheet PDF. This datasheet also covers the MIMX8MQ7CVAHZAA variant, as both devices belong to the same applications processors family and are provided as variant models within a single manufacturer datasheet.

Key Features

  • Feature Quad symmetric Cortex-A53 processors:.
  • 32 KB L1 Instruction Cache.
  • 32 KB L1 Data Cache.
  • Support L1 cache RAMs protection with parity/ECC Support of 64-bit Armv8-A architecture:.
  • 1 MB unified L2 cache.
  • Support L2 cache RAMs protection with ECC.
  • Frequency of 1.5 GHz 16 KB L1 Instruction Cache 16 KB L1 Data Cache 256 KB tightly coupled memory (TCM) Two PCI Express Gen2 interfaces Two USB 3.0/2.0 controllers with integrated PHY interfaces.

📥 Download Datasheet

Note: The manufacturer provides a single datasheet file (MIMX8MQ7CVAHZAA-NXP.pdf) that lists specifications for multiple related part numbers.

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Other Datasheets by NXP Semiconductors

Part Number Description
MIMX8MD7CVAHZAA Applications Processors
MIMX8MD7DVAJZAA i.MX 8M Dual / 8M QuadLite / 8M Quad Applications Processors
MIMX8MD6CVAHZAA Applications Processors
MIMX8MD6CVAHZAB Applications Processors
MIMX8MD6DVAJZAA i.MX 8M Dual / 8M QuadLite / 8M Quad Applications Processors

Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

View original datasheet text
NXP Semiconductors Data Sheet: Technical Data Document Number: IMX8MDQLQIEC Rev. 3, 04/2021 MIMX8MQ6CVAHZAA MIMX8MD6CVAHZAA MIMX8MQ5CVAHZAA MIMX8MQ6CVAHZAB MIMX8MD6CVAHZAB MIMX8MQ5CVAHZAB i.MX 8M Dual / 8M QuadLite / 8M Quad Applications Processors Data Sheet for Industrial Products Package Information Bare Die Package FBGA 17 x 17 mm, 0.65 mm pitch Ordering Information See Table 2 on page 6 1 i.MX 8M Dual / 8M QuadLite / 8M Quad introduction The i.MX 8M Dual / 8M QuadLite / 8M Quad processors 1. i.MX 8M Dual / 8M QuadLite / 8M Quad introduction . . . 1 represent NXP’s latest market of connected streaming 1.1. Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 audio/video devices, scanning/imaging devices, and 2. 1.2. Ordering information . . . . . . . .