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MMZ25332BT1 - Heterojunction Bipolar Transistor

General Description

1 F Chip Capacitors Part Number GRM155R61A105KE15 C2, C5, C7, C8, C10, C11, C15 Components Not Placed C3 470 pF Chip Capacitor GRM1555C1H471JA01 C4 8.2 pF Chip Capacitor 04023J8R2BBS C6 4.7 F Chip Capacitor GRM188R60J475KE19D C9, C14 22 pF Chip Capacitors 04023J22R0BBS C13 3.3 pF

Key Features

  • Frequency: 1500.
  • 2800 MHz.
  • P1dB: 33 dBm @ 2500 MHz.
  • Power gain: 26.5 dB @ 2500 MHz.
  • OIP3: 48 dBm @ 2500 MHz.
  • EVM ≤ 3% @ 23.5 dBm Pout, WLAN (802.11g).
  • Active bias control (adjustable externally).
  • Power down control via VBIAS pin.
  • Class 3A HBM ESD rating.
  • Single 3 to 5 V supply.
  • Single--ended power detector.
  • Cost--effective 12--pin, 3 mm QFN surface mount plastic package Table 1. Typical CW Performance (1) Characteristic 1800 2500.

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NXP Semiconductors Technical Data Document Number: MMZ25332B Rev. 3, 11/2017 Heterojunction Bipolar Transistor Technology (InGaP HBT) High Efficiency/Linearity Amplifier The MMZ25332B is a 2--stage, high linearity InGaP HBT broadband amplifier designed for femtocell, picocell, WLAN (802.11g/n), W--CDMA, TD--SCDMA and LTE wireless broadband applications. It provides exceptional linearity for LTE and W--CDMA air interfaces with an ACPR of –50 dBc at an output power of up to 22 dBm, covering frequencies from 1500 to 2800 MHz. It operates from a supply voltage of 3 to 5 V. The amplifier is fully input matched, requires minimal external matching on the output and is housed in a cost--effective, surface mount QFN 3  3 package.