NXP Semiconductors P2020
the P2020 feature set: • Dual high-performance Power Architecture® e500 cores. 102 4.1 Package Parameters for the P2020 WB-TePBGA .| Part No. | P2020 |
|---|---|
| Datasheet | P2020 Download |
| Manufacturer |  NXP Semiconductors |
| Description | QorIQ Integrated Processor |
| Buy | Stock & Price |
ELECTRICAL CHARACTERISTICS
. . . . . . . . . . . . . . . . . . . . . . . . . . . .29 2.1 Overall DCELECTRICAL CHARACTERISTICS
. . . . . . . . . . . . . .29 2.2 Power Sequencing . . . . . . . . . . . . . . . . . . . . . . . . . . . .33 2.3 Power Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . .34 2.4 Input Clocks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .35 2.5 RESET Initialization . . . . . . . . . . . . . . . . . . . . . . . . . . .39 2.6 Power-on Ramp Rate . . . . . . . . . . . . . . . . . . . . . . . . . .40 2.7 DDR2 and DDR3 SDRAM . . . . . . . . . . . . . . . . . . . . . .40 2.8 eSPI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .46 2.9 DUART . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .48 2.10 Ethernet: Enhanced Three-Speed Ethernet (eTSEC), MII Management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .49 2.11 USB. . . . . . . . . . . . . . . . . . . . . . . . . . . . .
