PDTC143TMB Datasheet (PDF) Download
NXP Semiconductors
PDTC143TMB

Description

Leadless ultra small plastic package; 3 solder lands; body 1.0 x 0.6 x 0.37 mm 4.

Key Features

  • 100 mA output current capability
  • Reduces ponent count
  • Built-in bias resistors
  • Reduces pick and place costs
  • Simplifies circuit design
  • AEC-Q101 qualified
  • Leadless ultra small SMD plastic
  • Low package height of 0.37 mm
  • Low-current peripheral driver
  • Control of IC inputs