PEMD48 Datasheet (PDF) Download
NXP Semiconductors
PEMD48

Key Features

  • 300 mW total power dissipation
  • Very small 1.6 mm × 1.2 mm × 0.55 mm ultra thin package
  • Reduces required board space
  • Reduces pick and place costs
  • Self alignment during soldering due to straight leads. APPLICATIONS
  • General purpose switching and amplification
  • Inverter and interface circuits
  • Circuit driver. DESCRIPTION NPN/PNP resistor-equipped transistors in a SOT666 plastic package
  • Transistor mounted on an FR4 printed-circuit board. - Transistor mounted on an FR4 printed-circuit board
  • The only remended soldering method is reflow soldering. PARAMETER 2001 Nov 07