• Part: S32G3
  • Description: high-performance vehicle network processors
  • Manufacturer: NXP Semiconductors
  • Size: 1.62 MB
Download S32G3 Datasheet PDF
NXP Semiconductors
S32G3
S32G3 is high-performance vehicle network processors manufactured by NXP Semiconductors.
S32G3 Data Sheet Rev. 2 - 02/2023 Data Sheet: Technical Data - This document provides electrical specifications for S32G3. - For functional characteristics and the programming model, see S32G3 Reference Manual. NXP reserves the right to change the detail specifications as may be required to permit improvements in the design of its products. Contents 1 1.1 1.2 2 3 4 5 6 7 7.1 7.2 8 9 9.1 9.2 9.3 10 10.1 10.2 11 12 13 13.1 13.2 13.3 14 14.1 15 15.1 15.2 15.3 16 16.1 16.1.1 16.1.2 16.1.3 16.1.4 16.2 16.2.1 16.2.2 16.2.3 16.2.4 16.2.5 16.3 16.3.1 16.3.2 16.3.4 Introduction.........................................................4 Overview......................................................... 4 Applications.....................................................4 Block diagram.....................................................5 Feature parison........................................... 5 Ordering information...........................................8 Electrostatic Discharge (ESD) Characteristics... 9 Absolute Max Ratings........................................ 9 Operating conditions........................................ 13 Operating Conditions.................................... 13 Clock frequency ranges................................ 19 Thermal Characteristics................................... 22 DC electricals................................................... 22 Total power specifications for 0.8V and 1.8V Analog Domains............................................22 Static power specifications for I/O Domains. 24 Device Power and Operating Current Specifications................................................ 25 Power sequencing............................................29 Power-up.......................................................29 Power-down.................................................. 30 Electromagnetic patibility (EMC)............... 30 GPIO Pads....................................................... 30 Aurora specifications.......