• Part: SA58671
  • Description: 1.2 W/channel Stereo Class-D Audio Amplifier
  • Manufacturer: NXP Semiconductors
  • Size: 236.01 KB
Download SA58671 Datasheet PDF
NXP Semiconductors
SA58671
SA58671 is 1.2 W/channel Stereo Class-D Audio Amplifier manufactured by NXP Semiconductors.
1.2 W/channel stereo class-D audio amplifier Rev. 01 - 21 December 2007 Product data sheet 1. General description The SA58671 is a stereo, filter-free class-D audio amplifier which is available in a 16 bump WLCSP (Wafer Level Chip-Size Package). .. The SA58671 Features independent shutdown controls for each channel. The gain can be set at 6 d B, 12 d B, 18 d B or 24 d B using G0 and G1 gain select pins. Improved immunity to noise and RF rectification is increased by high PSRR and differential circuit topology. Fast start-up time and very small WLCSP package makes it an ideal choice for both cellular handsets and PDAs. The SA58671 delivers 1.3 W/channel at 5 V and 720 m W/channel at 3.6 V into 8 Ω. It delivers 1.2 W/channel at 5 V into 4 Ω. The maximum power efficiency is excellent at 70 % to 74 % into 4 Ω and 84 % to 88 % into 8 Ω. The SA58671 provides thermal and short-circuit shutdown protection. 2. Features I Output power: N 1.2 W/channel into 4 Ω at 5 V N 1.3 W/channel into 8 Ω at 5 V N 720 m W/channel into 8 Ω at 3.6 V I Supply voltage: 2.5 V to 5.5 V I Independent shutdown control for each channel I Selectable gain: 6 d B, 12 d B, 18 d B and 24 d B I High SVRR: - 77 d B at 217 Hz I Fast start-up time: 3.5 ms I Low supply current I Low shutdown current I Short-circuit and thermal protection I Space savings with 2.06 mm × 2.11 mm 16 bump WLCSP package I Low junction to ambient thermal resistance of 110 K/W with adequate heat sinking of WLCSP 3. Applications I I I I Wireless and cellular handsets and PDA Portable DVD player USB speaker Notebook PC NXP Semiconductors 1.2 W/channel stereo class-D audio amplifier I Portable radio and gaming I Educational toy 4. Ordering information Table 1. Ordering information Package Name SA58671UK WLCSP16 Description wafer level chip-size package; 16 bumps; 2.06 × 2.11 × 0.6 mm Version SA58671UK Type number .. 5. Block diagram PVDD A2 C4 INRP D1 right input INRN C1 GAIN ADJUST...