NXP Semiconductors SAA6713H
The input section handles incoming data up to SXGA resolution that can be downscaled individually in width and height to fit to the connected panel resolution.FEATURES
GENERAL DESCRIPTION
QUICK REFERENCE DATA ORDERING INFORMATION BLOCK DIAGRAM PINNING FUNCTIONALDESCRIPTION
Programming registers Device ID Initialization Clock management Synchronization pulse distribution Interrupt generation Triple analog-to-digital converter DVI interface Input interface Colour processing RGB mode detection and auto-adjustment Decoupling FIFO Scaling On screen display Colour look-up table Dithering unit Output interface 8 8.1 8.2 9 10 11 12 13 14 15 15.1 15.2 15.3 15.4 15.5 16 17 18 19 BOUNDARY SCAN TEST SAA6713H Initialization of boundary scan circuit Device identification codes LIMITING VALUES THERMAL CHARACTERISTICS CHARACTERISTICS TIMING CHARACTERISTICS APPLICATION INFORMATION PACKAGE OUTLINE SOLDERING Introduction to soldering surface mount packages Reflow soldering Wave soldering Manual soldering Suitability of surface mount IC packages for wave and reflow soldering methods DATA SHEET STATUS DEFINITIONS DISCLAIMERS PURCHASE OF PHILIPS I2C COMPONENTS 2...