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SL2ICS2001DW - I-CODE SLI Label IC bumped wafer specification on UV-tape

General Description

This specification describes the electrical, physical and dimensional properties of Au-bumped sawn wafers on FFC with UV-tape of I-CODE SLI Label ICs on an NXP C075EE process and is the base for delivery of tested I-CODE SLI Label ICs.

2.

Table 1.

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SL2ICS2001DW/V1D I-CODE SLI Label IC bumped wafer specification on UV-tape Rev. 3.0 — 5 February 2008 150030 Product data sheet addendum PUBLIC 1. General description This specification describes the electrical, physical and dimensional properties of Au-bumped sawn wafers on FFC with UV-tape of I-CODE SLI Label ICs on an NXP C075EE process and is the base for delivery of tested I-CODE SLI Label ICs. 2. Ordering information Table 1. Ordering information Type number Package Name SL2ICS2001DW/V1D - Description Bumped die on sawn wafer on UV-tape 3. Mechanical specification Odering code 9352 795 61005 3.1 Wafer • Diameter: • Thickness: 3.2 Wafer backside • Material: • Treatment: • Roughness: 3.3 Chip dimensions • Chip size: • Scribe lines: 3.