SL2ICS2001DW datasheet by NXP Semiconductors.
| Part number | SL2ICS2001DW |
|---|---|
| Datasheet | SL2ICS2001DW_NXP.pdf |
| File Size | 160.53 KB |
| Manufacturer | NXP Semiconductors |
| Description | I-CODE SLI Label IC bumped wafer specification on UV-tape |
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This specification describes the electrical, physical and dimensional properties of Au-bumped sawn wafers on FFC with UV-tape of I-CODE SLI Label ICs on an NXP C075EE process and is the base for delivery of tested I-CODE SLI Label ICs. Ordering information Table 1. Ordering information Type number Package Name SL2ICS2001DW/V1D - Description Bumped die on sawn wafer on UV-tape.
View all NXP Semiconductors datasheets
| Part Number | Description |
|---|---|
| SL2ICS2001V1D | I-CODE SLI Label IC bumped wafer specification on UV-tape |
| SL2S2002 | ICODE SLIX |
| SL2S2102 | ICODE SLIX |
| SL2S2602 | ICODE SLIX2 |
| SL2S3003 | ICODE 3 |
| SL2S3003TT | ICODE 3 |
| SL2S3103 | new contactless HF-RFID |
| SL2S5002 | ICODE SLIX-L |
| SL2S5102 | ICODE SLIX-L |
| SL2S5302 | ICODE SLIX-S |
