SL2ICS2001DW
SL2ICS2001DW is I-CODE SLI Label IC bumped wafer specification on UV-tape manufactured by NXP Semiconductors.
SL2ICS2001DW/V1D
I-CODE SLI Label IC bumped wafer specification on UV-tape
Rev. 3.0
- 5 February 2008
Product data sheet addendum
PUBLIC
1. General description
This specification describes the electrical, physical and dimensional properties of Au-bumped sawn wafers on FFC with UV-tape of I-CODE SLI Label ICs on an NXP C075EE process and is the base for delivery of tested I-CODE SLI Label ICs.
2. Ordering information
Table 1. Ordering information
Type number
Package
Name
SL2ICS2001DW/V1D
- Description Bumped die on sawn wafer on UV-tape
3. Mechanical specification
Odering code 9352 795 61005
3.1 Wafer
- Diameter:
- Thickness:
3.2 Wafer backside
- Material:
- Treatment:
-...
