Datasheet Details
| Part number | SOT1061 |
|---|---|
| Manufacturer | NXP Semiconductors |
| File Size | 181.30 KB |
| Description | plastic thermal enhanced ultra thin small outline package |
| Datasheet | SOT1061-NXP.pdf |
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Overview: HUSON3 SOT1061 DFN2020-3: plastic thermal enhanced ultra thin small outline package; no leads; 3 terminals; body 2 x 2 x 0.65 mm 8 February 2016 Package information 1.
| Part number | SOT1061 |
|---|---|
| Manufacturer | NXP Semiconductors |
| File Size | 181.30 KB |
| Description | plastic thermal enhanced ultra thin small outline package |
| Datasheet | SOT1061-NXP.pdf |
|
|
|
| Part Number | Description |
|---|---|
| SOT109-1 | Package outline |
| SOT1699-1 | low profile quad flat package |
| SOT263 | Package outline |
| SOT27-1 | Package outline |
| SOT313-2 | LQFP48 Reel pack Packing information |
| SOT314-2 | Packing information |
| SOT353 | plastic surface-mounted package |
| SOT363 | Plastic surface-mounted package |
| SOT407-1 | plastic low profile quad flat package |
| SOT414-1 | plastic low profile quad flat package |