SOT109-1 Description
2003 Mar 24 Philips Semiconductors Package outline SO16: plastic small outline package; Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.
SOT109-1 is Package outline manufactured by NXP Semiconductors.
| Part Number | Description |
|---|---|
| SOT1061 | plastic thermal enhanced ultra thin small outline package |
| SOT1699-1 | low profile quad flat package |
| SOT263 | Package outline |
| SOT27-1 | Package outline |
| SOT313-2 | LQFP48 Reel pack Packing information |
2003 Mar 24 Philips Semiconductors Package outline SO16: plastic small outline package; Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.