SOT109-1 Overview
2003 Mar 24 Philips Semiconductors Package outline SO16: plastic small outline package; Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.
SOT109-1 datasheet by NXP Semiconductors.
| Part number | SOT109-1 |
|---|---|
| Datasheet | SOT109-1_PhilipsSemiconductors.pdf |
| File Size | 10.92 KB |
| Manufacturer | NXP Semiconductors |
| Description | Package outline |
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2003 Mar 24 Philips Semiconductors Package outline SO16: plastic small outline package; Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.
View all NXP Semiconductors datasheets
| Part Number | Description |
|---|---|
| SOT1061 | plastic thermal enhanced ultra thin small outline package |
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| SOT27-1 | Package outline |
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| SOT314-2 | Packing information |
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| SOT363 | Plastic surface-mounted package |
| SOT407-1 | plastic low profile quad flat package |
| SOT414-1 | plastic low profile quad flat package |