NXP Semiconductors TDA8512J
The TDA8512J is an integrated class-B output amplifier in a 17-lead Single-In-Line (SIL) power package. It contains 4 × 13 W Single Ended (SE) amplifiers of which two can be used to configure a 26 W BTL amplifier. 2001 Nov 16 5 Philips Semiconductors Preliminary specification 26 W BTL and 2 × 13 W SE or 4 × 13 W SE power amplifier 8 FUNCTIONAL DESCRIPTION 8.2 Mode select TDA8512J The TDA8512J contains four identical amplifiers and can be used in the configurations: • Two SE channels (fixed gain 20 dB) and one...TDA8512J Specifications
- Min Voltage : 6V
- Max Voltage : 18V
- Terminals : 17
- Circuits : 1
- Channels : 4
- Bandwidth : 20kHz
- Max Operating Temp : 85°C
- Min Operating Temp : -40°C
- Max Supply Current : 160mA
Source:
Octopart
| Part No. | TDA8512J |
|---|---|
| Datasheet | TDA8512J Download |
| Manufacturer |  NXP Semiconductors |
| Description | 26 W BTL and 2 x 13 W SE or 4 x 13 W SE power amplifier |
| Buy | Stock & Price |
FEATURES
APPLICATIONS
GENERAL DESCRIPTION
QUICK REFERENCE DATA ORDERING INFORMATION BLOCK DIAGRAM PINNING FUNCTIONALDESCRIPTION
Mode select switch Mode select Built-in protection circuits Short-circuit protection LIMITING VALUES HANDLING THERMAL CHARACTERISTICS DC CHARACTERISTICS AC CHARACTERISTICS APPLICATION INFORMATION Input configuration Output power Power dissipation Supply Voltage Ripple Rejection (SVRR) Switch-on and switch-off PCB layout and grounding Typical performance characteristics 15 16 16.1 16.2 16.3 16.4 17 18 19 PACKAGE OUTLINE SOLDERING TDA8512J Introduction to soldering through-hole mount packages Soldering by dipping or by solder wave Manual soldering Suitability of through-hole mount IC packages for dipping and wave soldering methods DATA SHEET STATUS DEFINITIONS DISCLAIMERS 2001 Nov 16 2 Philips Semiconductors Preliminary specification 26 W BTL and 2 × 13 W SE or 4 × 13 W SE power amplifier 1FEATURES
● Flexible leads● Low thermal resistance TDA8512J
● Requires ve...
