TDA8924 Description
bill of materials Curves measured in the reference design PACKAGE OUTLINE SOLDERING Introduction to soldering surface mount packages Reflow soldering Wave soldering Manual soldering Suitability of surface mount IC packages for wave and reflow soldering methods DATA SHEET STATUS DEFINITIONS DISCLAIMERS 2003 Jul 28 2 Philips Semiconductors Objective specification 2 × 120 W class-D power amplifier.