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TDA8926 Datasheet Power stage 2 x 50 W class-D audio amplifier

Manufacturer: NXP Semiconductors

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General Description

QUICK REFERENCE DATA ORDERING INFORMATION BLOCK DIAGRAM PINNING FUNCTIONAL DESCRIPTION Power stage Protection Overtemperature Short-circuit across the loudspeaker terminals BTL operation LIMITING VALUES THERMAL CHARACTERISTICS QUALITY SPECIFICATION DC CHARACTERISTICS AC CHARACTERISTICS SWITCHING CHARACTERISTICS Duty factor 15 15.1 15.2 15.3 15.4 15.5 15.6 16 17 17.1 17.2 17.3 17.4 18 19 20 TDA8926 TEST AND APPLICATION INFORMATION BTL application Package ground connection Output power Reference design Reference design bill of material Curves measured in reference design PACKAGE OUTLINE SOLDERING Introduction to soldering through-hole mount packages Soldering by dipping or by solder wave Manual soldering Suitability of through-hole mount IC packages for dipping and wave soldering methods DATA SHEET STATUS DEFINITIONS DISCLAIMERS 2002 Oct 10 2 Philips Semiconductors Preliminary specification Power stage 2 × 50 W class-D audio amplifier 1

Overview

INTEGRATED CIRCUITS DATA SHEET TDA8926 Power stage 2 × 50 W class-D audio amplifier Preliminary specification Supersedes data of 2002 Feb 07 2002 Oct 10 Philips Semiconductors Preliminary specification Power stage 2 × 50 W class-D audio amplifier CONTENTS 1 2 3 4 5 6 7 8 8.1 8.2 8.2.1 8.2.2 8.3 9 10 11 12 13 14 14.

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